Micro Lens Array (MLA) Solutions
Micro Lens Array (MLA) Solutions
- Features
- High Uniformity of RoC, Conic and Pitch
- Customized packaging is available
- Very Low Scattering
- High Transmission
- 6” Silica or Si substrate
- Applications
- Fiber array collimation & coupling
- Wavelength selective switching
- Coupling with Si Photonics chip
- CPO interconnection
Overview
Fused silica and Si MLA can be manufactured using ICP etching process and thermal reflow process of thick PR on 6” wafers. General mold methods require individual molds to be manufactured according to lens design (especially ROC), but the PR reflow method can manufacture MLAs with various ROCs by adjusting the sag using a single photomask, which reduces the manufacturing cost. In addition, it is suitable for mass production because it can manufacture highly reliable wafers using semiconductor process technology. MLA provide high pitch accuracy, excellent uniformity and high coupling efficiency with fiber, waveguide or photodiode arrays. Optical communication systems require MLA for coupling between laser sources, fiber and waveguide arrays, optical multiplexing and optical switching.
- 40° polished FA with MLA : vertical coupling
- Coupling with grating coupler of SiPh chip
- On Board Optics, Co-Packaged Optics
- Customized type is available
- Flat polished FA with MLA
- CButt coupling with fiber for collimation or edge coupling with SiPh chip for spot size control
- Collimator
| Parameter | Unit | Spec. |
|---|---|---|
| Lens Surface Profile | Spherical | |
| Operation Wavelength | nm | 1310 or 1550 |
| Material | - | Fused Silica or Si |
| Working Distance | ≥ um | 100 (depending on the ROC or Sag |
| Number of Channel | ℃ | 8, Customized |
| Lens Diameter | Um | 100, 300, Customized |
| Sag | ≥ um | 3~10, Customized |
| Packaging with Fiber Array | - | Edge coupling type with flat polished FA, Grating coupling type with angled polished FA |